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Analysis of the current state of mini LED packaging

1. Basic packaging solutions for Mini L
2. Finding a balance between cost and performance parameters is the focus of the current stage
3. Link of the module in the middle
4. The driver IC sends control signals and data to the display panel in the form of electrical signals.
5. Driver ICs are mainly suppli by mainland Chinese manufacturers, Taiwanese manufacturers and Korean manufacturers
6. The driver IC link basically switches from PM control mode to AM control mode to achieve cost ruction
7. The main solution for Mini L backlight is still PCB
1. Basic packaging solutions for Mini L

Currently, there are mainly three types: POB, COB and COG

1) POB: Package on Board, a traditional packaging solution. The advantages are high solution maturity, equipment ecuador number data reusability and low cost; the disadvantage is the high OD value, which limits the expansion of its application scenarios. The main focus is mid- to low-end TV, monitor and automotive markets. In the short term, the POB solution dominates.

 

The advantage is to achieve Analysis of the

The module becomes lighter and thinner; the disadvantage is that the solution maturity nes to be improv, new equipment investment is requir, and the cost is high. In the mium to long term, COB solution is expect to become the mainstream.

2. Finding a balance between cost zahra negin owner and performance parameters is the focus of the current stage
The packaging link mainly achieves cost ruction through coordination and optimization of the light output angle. Packaging is not the main link in this cost ruction stage. For the current Mini L TV, finding a balance between cost and performance in different price ranges is the main consideration for terminal manufacturers when choosing packaging solutions.

COB has a more simplifi process Analysis of the

Product structure, and can be made thinner and lighter with a low OD value, but there is still a gap in yield, industrial chain compliance central african leads and cost compar with POB. In terms of cost ruction, the current mainstream solution is to increase the light output angle of a single L through lenses, dosing and other solutions, and jointly use optimiz optical solutions to ruce the total amount of L bulbs/chips us.

 

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